Apsara Downhole Tools
Advancing Technologies for Energy Industry
Our Technologies
Innovative Ultrasonic Element Fabrication
Uses advanced manufacturing methods (e.g., sol-gel, tape casting) for precise, high-performance piezo elements.
Modular “Plug & Play” Architecture
Components are designed for easy integration into different tool configurations.
Extended Temperature Range
Materials and packaging designed for high-reliability operation in extreme downhole temperatures.
Compact & Power-Efficient Design
Designed for limited downhole space and power budgets without compromising signal quality.
Customizable Sensor Arrays
Sensor configurations can be tailored to customer needs—axial, circumferential, multi-mode, etc.
Linear Array on Flexible Substrate
High-resolution imaging begins with high-quality data, enabled by precision-engineered, high-performance piezo elements fabricated using advanced manufacturing techniques.
These elements are part of a modular ultrasonic array designed for seamless integration into various downhole tool configurations, enabling high-resolution imaging of downhole features.